Посмотреть полный размер
DF160R12W2H3F_B11
Description:
Fast and solder-less assembly is possible using our EasyPACK 2B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Категории
Fast and solder-less assembly is possible using our EasyPACK 2B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Infineon Technologies, Срок поставки 1 неделя |
order@globuschip.ru