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DF200R12W1H3_B27
Description:
Fast and solder-less assembly is possible using our EasyPACK 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Категории
Fast and solder-less assembly is possible using our EasyPACK 1B 1200V booster IGBT modules with the proven PressFIT technology and High Speed IGBT H3.
Infineon Technologies, Срок поставки 1 неделя |
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