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DF75R12W1H4F_B11
Description:
Fast and solder-less assembly is possible using our EasyPACK 1B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H2.
Категории
Fast and solder-less assembly is possible using our EasyPACK 1B 1200V chopper IGBT modules with the proven PressFIT technology and High Speed IGBT H2.
Infineon Technologies, Срок поставки 1 неделя |
order@globuschip.ru